岗位职责:
1.Physical implementation of advanced technology chips.
2.Design methodology development and innovation for advanced technology challenges.
3.Be responsible for 22/16/12/10/7/5nm chip implementation for customer’s projects or internal system test chips.
4.Be responsible for advanced node PPA benchmark, and solution development.
5.EDA tool new features enablement.
6.Customer onsite/offsite supports will be required on demand.
任职要求:
1.MS or above in EE, CS related fields. Experience in APR, physical verification, chip implementation, or CAD development is plus.
2.New graduate or 3 years working experience in chip physical implementation.
3.Familiar with Synopsys/Cadence APR tools/flows.
4.Familiar with TCL/Perl/Python programming.
5.Experience with TSMC advanced technology is plus.
6.Proven record in production tape-outs is plus.